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A Novel Cost-Effective Unmanned Ground Vehicle Platform for Robotics Education

Clyde Sanmig Domin D. Corpuz, Gilroy A. Cuaycong, Raffaello Giuliano D. Diño, Raphael C. Estacio, Gregg Angelo C. Señar, Alvin Y. Chua

Abstract


This study demonstrates a novel unmanned ground vehicle platform suitable for educational robotics that is cost-effective, modular, and utilizes 3D-printed components. The methodology involved creating three UGV designs using Fusion 360 and implementing Finite Element Analysis (FEA) testing in ANSYS to identify potential failure points. The team tested various configurations, including 3D-printed and aluminium components, to find an appropriate balance between durability and cost-effectiveness. Using GPS accuracy and incline navigation, the authors assessed the UGV's capabilities, feasibility, and educational value. The study peer reviews identified standards the UGV should adhere to develop a modular, cost-effective, and feasible learning platform. The platform demonstrated outdoor capabilities and the capacity to perform efficiently using proper specifications. Students and an instructor evaluated various aspects of the UGV platform through workshops conducted by the authors. The assembly received positive ratings, with an average rating of 4 out of 5 on a Likert scale. Issues pointed out by the participants included loose screw threading and the complexity of the fastening screws and nuts. The seamlessness of electronic connection and modules was also rated, with participants rating the battery capacity and Pixhawk unit with 4.17 to 4.21 out of 5 on the scale. However, the Mission Planner assessment showed a significant drop in learning curve evaluation due to the overwhelming interface of the software for new users. The overall performance of the UGV was rated at 4 out of 5 due to its 3D-printed frame. Participants observed that inclines and turning capability were notable features of the UGV platform. The open-source platform features multiple outdoor-specific components, including a distance sensor, GPS, and wireless telemetry. With the option of adding a bump sensor and a co-processor as needed, the UGV platform achieved its goal of being a cheaper alternative to commercially available robotics kits while offering more features for custom configurations.

 

Doi: 10.28991/HIJ-2025-06-01-020

Full Text: PDF


Keywords


Modularity; Chassis Design; Finite Element Analysis (FEA); Educational Robotics.

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Full Text: PDF

DOI: 10.28991/HIJ-2025-06-01-020

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Copyright (c) 2025 Clyde Sanmig Domin Dawis Corpuz, Gilroy Andrada Cuaycong, Raffaello Giuliano De Guzman Diño, Raphael Carlos Estacio, Gregg Angelo Cabarrubias Señar, Alvin Yu Chua